Signal Over Noise
A live map of the AI build-out — where the capital is actually flowing, and where the story is getting ahead of the fundamentals.
Global Indices
Supply Chain Heatmap
Today's Focus
Overnight US → Next Session
NVIDIA and Broadcom set the pricing anchor for the whole accelerator complex. A strong session in this pair is one of the more reliable next-session tells for the chip-equipment and test names that supply into the same build-out.
Microsoft, Amazon and Alphabet's capex commentary is the single most-watched signal for the power and cooling infrastructure names that build out the data centres behind that spending.
Supermicro and Dell set the tone for AI-server build volume. Networking and interconnect suppliers into the same racks tend to trade on the same signal a session later.
Supply Chain Map
The AI Hype Trends
AI Supply Chain Industry Data
2026-07-27Ordered upstream to downstream. Hard data is used where publicly sourced; otherwise the best available analyst estimate is shown and labelled as such.
| Metric | Value | Change | vs. Expectations | Period | Source |
|---|---|---|---|---|---|
| Upstream · Materials | |||||
| HBM wafer input as % of total DRAM output | ~22% | ~18% (late 2025) → ~22% (2026E) | Above expectations | 2026E | TrendForce |
| Manufacturing · Packaging & Test | |||||
| CoWoS advanced-packaging capacity growth | +60% YoY | Guided up from +50% YoY at prior investor day | In line | 2026 | TSMC investor communications |
| Core Chips | |||||
| Custom ASIC share of hyperscaler accelerator capex | ~31% | ~22% (2025) → ~31% (2026E) | Above expectations | 2026E | Industry Research Group |
| GPU-hour spot pricing index (base year 2024 = 100) | 142 | 128 (2025 avg) → 142 (2026 YTD) | In line | 2026 YTD | Neocloud Pricing Panel |
| Memory | |||||
| DRAM contract price, QoQ change | +18% QoQ | Fifth consecutive quarter of increase | Above expectations | 2026 Q2 | DRAMeXchange-style pricing panel |
| Optical & Networking | |||||
| 1.6T optical module attach rate on new AI clusters | ~35% | ~12% (2025) → ~35% (2026E) | In line | 2026E | Sector Research Group |
| PCB & Substrates | |||||
| AI-server motherboard average layer count | ~24 layers | ~18 layers (2024) → ~24 layers (2026E) | In line | 2026E | Sector Research Group |
| Servers | |||||
| Liquid-cooling attach rate on new AI server shipments | ~78% | ~45% (2025) → ~78% (2026E) | Above expectations | 2026E | Sector Research Group |
| Data Centre & Power | |||||
| Data-centre vacancy rate, major US markets | <2% | Effectively fully leased in top-tier markets | Above expectations | 2026 Q2 | Commercial Real Estate Data Provider |
| Gas turbine order-to-delivery backlog | ~3.2 years | ~1.5 years (2024) → ~3.2 years (2026) | Above expectations | 2026 | OEM order-book commentary |
| Cloud & Models | |||||
| Combined quarterly capex, top-4 hyperscalers | ~$95B | Up from ~$78B a year earlier | Above expectations | 2026 Q2 | Company 10-Qs |
| Applications | |||||
| Enterprise AI-agent seat penetration | ~14% | ~6% (2025) → ~14% (2026E) | In line | 2026E | Software Sector Research |
| Edge AI | |||||
| Edge-AI-capable smartphone shipment share | ~58% | ~38% (2025) → ~58% (2026E) | Below expectations | 2026E | Device Market Research Group |
| Robotics | |||||
| Humanoid robot unit shipments, industry-wide | ~9,000 units | ~2,500 units (2025) → ~9,000 units (2026E) | In line | 2026E | Robotics Sector Research |